components
Altera demonstrates its 40G and 100G solutions at SUPERCOMM 2009
Attendees can see how Altera's 40G and 100G solutions are driving the development of next-generation applications such as OTU-3, OTU-4, 40G and 100G Ethernet, Interlaken, mobile backhaul and Next-Generation PON (NGPON)
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ST-Ericsson reports financial results for its first two months of operation
50/50 joint venture between Ericsson and STMicroelectronics started operations on February 2nd 2009, creating a new wireless-semiconductor industry leader
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Intel Developer Forum: one year Intel® Atom™ processor anniversary brings new chips, demonstration of next-generation device
Intel executives share vision, updates at Beijing Tech Event
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Texas Instruments new powerful, scalable LTE platform
Basestation manufacturers can meet carrier requirements to support data-intensive, next-generation mobile applications while keeping an eye on costs with TI’s new powerful, scalable LTE platform
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Industry´s smallest voltage level translator
Consumer electronics designers save cost and board space with the industry’s smallest, most highly integrated SD/MMC voltage level translator
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Texas Instruments introduces family of low power ADCs for high-density multi-channel applications
Texas Instruments Incorporated (TI) announced the ADS795x family of low power, precision SAR analog-to-digital converters (ADC) in a small form factor
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